Welcome!

Symbian Authors: Jack Newton, Kevin Benedict, Matthew Lobas, Shelly Palmer, RealWire News Distribution

News Feed Item

Canon U.S.A. Commences Sale of New FPA-3030i5+ Stepper for High-Volume Production of LED, MEMS and Other Environmentally Conscious Devices

Canon U.S.A., Inc., a leader in digital imaging solutions, recently launched sales of the new FPA-3030i5+ i-line stepper. The FPA-3030i5+ is designed to provide a long-term manufacturing solution for manufacturers of energy-efficient, environmentally conscious devices*1 including Light-Emitting Diodes (LEDs),MicroElectroMechanical Systems (MEMS)*2 and power semiconductors*3.

As awareness of clean energy and energy conservation continues to increase, demand has simultaneously increased for new environmentally conscious technologies including wind and solar power, high-efficiency vehicles and low-power facilities. As a result, manufacturers of these devices have unique process requirements that have been incorporated into the FPA-3030i5+ semiconductor stepper design that, along with optional equipment available to be purchased separately, will help facilitate these process requirements.

The FPA-3030i5+ represents a new product platform, designed specifically to provide a flexible solution for a variety of users, including power semiconductor, LED and MEMS manufacturers.

Canon FPA-3030 platform provides performance and productivity improvements

The FPA-3030 platform represents an upgrade to earlier Canon “FPA-3000 platform” steppers. The FPA-3030i5+ features an overhauled software structure and electrical control system that allow application of optional advanced hardware (e.g., projection lens, wafer stage, and alignment system) that is not compatible with traditional FPA-3000 platform steppers.

The FPA-3030i5+ is capable of providing imaging resolution below 0.35μm*4, while maintaining overlay accuracy of less than or equal to 40nm*5 and throughput equal to or in excess of 104 wafers per hour*6. Canon developed the FPA-3030i5+ system to meet and exceed the imaging, overlay and productivity requirements of those environmentally conscious devices and MEMS manufacturers.

Canon FPA-3030 platform supports optional equipment designed for special substrate materials required for energy reducing devices and MEMS manufactures

The FPA-3030 platform allows the use of optional equipment designed for the processing of silicon (Si), sapphire (Al2O3), silicon carbide (SiC) and a wide variety of wafer materials used in environmentally conscious device manufacturing. Optional equipment for the FPA-3030i5+ includes warped-wafer handling systems to allow processing of distorted substrates, and advanced image processing systems for clear substrates.

With the purchase of the optional Multi-Size Wafer Kit, the FPA-3030i5+ stepper can also be configured to process multiple wafer sizes, and can be equipped with other optional equipment to help improve productivity and efficiency.

Canon FPA-3030i5+ stepper feature summary

1. FPA-3030i5+ imaging system provides 0.35μm resolution with a flexible optical system and lens

  • FPA-3030i5+ lens and optical system specifications equal FPA-3000 platform specifications.
  • Variable Lens NA (0.45-0.63) and illumination Sigma (σ, 0.3-0.7 @ NA0.63) allows control of resolution and depth of focus.
  • The FPA-3030i5+ optical system supports Off-Axis Illumination and provides imaging resolution requested by manufacturers of energy efficient devices.

2. FPA-3030i5+ platform enhancements help provide alignment accuracy and reliability

  • FPA-3030i5+ is equipped with field-proven stage drive and damper control systems to provide high stability and reliability.
  • Wafer stage position is controlled by Laser Interferometer System and wafer alignment scope.
  • FPA-3030i5+ is capable of overlay accuracy less than or equal to 40nm to support production of highly efficient devices.

3. FPA-3030i5+ platform supports optional equipment designed to process special environmentally conscious device substrates

  • With the purchase of the optional special-substrate handling system, the FPA-3030i5+ supports special substrates widely used in manufacturing of environmentally conscious devices, including silicon (Si), sapphire (Al2O3) and gallium arsenide (GaAs).
  • With the purchase of the optional warped wafer handling system the FPA-3030i5+ supports processing of wafers warped and distorted by earlier process steps.
  • FPA-3030i5+ supports overlay correction for random wafer distortion effects.
  • With the purchase of the optional Multi-Size Wafer Kits, the FPA-3030i5+ can process multiple wafer sizes (75mm & 100mm; 100mm & 150mm; 150mm & 200mm) without additional configuration change.

4. FPA-3030i5+ platform electrical control system and software are modernized to help support future semiconductor manufacturing

  • FPA-3030i5+ adopts systems developed for the “FPA-5500 platform” steppers. FPA-5500 steppers are widely accepted as a leading exposure system for high-volume memory devices*7, image sensors*8 and advanced packaging applications.
  • The new FPA-3030i5+ e-Console software structure allows compatibility and migration of process and exposure conditions from earlier FPA-3000 platform systems

Market trends for semiconductor lithography equipment

Demand for low-power consumption systems and vehicles, social infrastructure improvements such as wind, solar and smart grid products have increased as society becomes more aware of the importance of conserving energy and reducing environmental impacts. Semiconductor lithography equipment supporting environmentally conscious devices must provide process flexibility to meet the wide range of requirements from manufacturers of environmentally conscious devices.

About Canon U.S.A., Inc.

Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions. With approximately $45.6 billion in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents registered in 2011† and is one of Fortune Magazine's World’s Most Admired Companies in 2012. In 2012, Canon U.S.A. has received the PCMag.com Readers’ Choice Award for Service and Reliability in the digital camera and printer categories for the ninth consecutive year, and for camcorders for the past two years. Canon U.S.A. is committed to the highest level of customer satisfaction and loyalty, providing 100 percent U.S.-based consumer service and support for all of the products it distributes. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To keep apprised of the latest news from Canon U.S.A., sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss.

Based on weekly patent counts issued by United States Patent and Trademark Office.

All referenced product names, and other marks, are trademarks of their respective owners.

Availability and specifications of all products are subject to change without notice.

*1 General term for electronic components designed to reduce environmental impact

*2 Electric machinery microelements used in smartphones, etc. (ex. accelerometer, gyroscope)

*3 Semiconductors to control motors, lighting, and power supply and conversion.

*4 1 μm (micrometer) = (1 meter) / ( 1 million)

*5 1 nm (nanometer) = (1 meter) / ( 1 billion)

*6 200mm wafers, 60 shots per wafer

*7 Memory devices used in digital information equipment such as smartphones and personal computers

*8 Image Sensors used in digital cameras and mobile phone cameras

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
Smart Cities are here to stay, but for their promise to be delivered, the data they produce must not be put in new siloes. In his session at @ThingsExpo, Mathias Herberts, Co-founder and CTO of Cityzen Data, discussed the best practices that will ensure a successful smart city journey.
WebRTC sits at the intersection between VoIP and the Web. As such, it poses some interesting challenges for those developing services on top of it, but also for those who need to test and monitor these services. In his session at WebRTC Summit, Tsahi Levent-Levi, co-founder of testRTC, reviewed the various challenges posed by WebRTC when it comes to testing and monitoring and on ways to overcome them.
For basic one-to-one voice or video calling solutions, WebRTC has proven to be a very powerful technology. Although WebRTC’s core functionality is to provide secure, real-time p2p media streaming, leveraging native platform features and server-side components brings up new communication capabilities for web and native mobile applications, allowing for advanced multi-user use cases such as video broadcasting, conferencing, and media recording.
The best-practices for building IoT applications with Go Code that attendees can use to build their own IoT applications. In his session at @ThingsExpo, Indraneel Mitra, Senior Solutions Architect & Technology Evangelist at Cognizant, provided valuable information and resources for both novice and experienced developers on how to get started with IoT and Golang in a day. He also provided information on how to use Intel Arduino Kit, Go Robotics API and AWS IoT stack to build an application tha...
Every successful software product evolves from an idea to an enterprise system. Notably, the same way is passed by the product owner's company. In his session at 20th Cloud Expo, Oleg Lola, CEO of MobiDev, will provide a generalized overview of the evolution of a software product, the product owner, the needs that arise at various stages of this process, and the value brought by a software development partner to the product owner as a response to these needs.
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex softw...
DevOps is being widely accepted (if not fully adopted) as essential in enterprise IT. But as Enterprise DevOps gains maturity, expands scope, and increases velocity, the need for data-driven decisions across teams becomes more acute. DevOps teams in any modern business must wrangle the ‘digital exhaust’ from the delivery toolchain, "pervasive" and "cognitive" computing, APIs and services, mobile devices and applications, the Internet of Things, and now even blockchain. In this power panel at @...
Internet of @ThingsExpo, taking place June 6-8, 2017 at the Javits Center in New York City, New York, is co-located with the 20th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @ThingsExpo New York Call for Papers is now open.
Web Real-Time Communication APIs have quickly revolutionized what browsers are capable of. In addition to video and audio streams, we can now bi-directionally send arbitrary data over WebRTC's PeerConnection Data Channels. With the advent of Progressive Web Apps and new hardware APIs such as WebBluetooh and WebUSB, we can finally enable users to stitch together the Internet of Things directly from their browsers while communicating privately and securely in a decentralized way.
The cloud market growth today is largely in public clouds. While there is a lot of spend in IT departments in virtualization, these aren’t yet translating into a true “cloud” experience within the enterprise. What is stopping the growth of the “private cloud” market? In his general session at 18th Cloud Expo, Nara Rajagopalan, CEO of Accelerite, explored the challenges in deploying, managing, and getting adoption for a private cloud within an enterprise. What are the key differences between wh...
WebRTC has had a real tough three or four years, and so have those working with it. Only a few short years ago, the development world were excited about WebRTC and proclaiming how awesome it was. You might have played with the technology a couple of years ago, only to find the extra infrastructure requirements were painful to implement and poorly documented. This probably left a bitter taste in your mouth, especially when things went wrong.
IoT is at the core or many Digital Transformation initiatives with the goal of re-inventing a company's business model. We all agree that collecting relevant IoT data will result in massive amounts of data needing to be stored. However, with the rapid development of IoT devices and ongoing business model transformation, we are not able to predict the volume and growth of IoT data. And with the lack of IoT history, traditional methods of IT and infrastructure planning based on the past do not app...
"LinearHub provides smart video conferencing, which is the Roundee service, and we archive all the video conferences and we also provide the transcript," stated Sunghyuk Kim, CEO of LinearHub, in this SYS-CON.tv interview at @ThingsExpo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
"There's a growing demand from users for things to be faster. When you think about all the transactions or interactions users will have with your product and everything that is between those transactions and interactions - what drives us at Catchpoint Systems is the idea to measure that and to analyze it," explained Leo Vasiliou, Director of Web Performance Engineering at Catchpoint Systems, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York Ci...
The 20th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held June 6-8, 2017, at the Javits Center in New York City, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit your speaking proposal ...
Discover top technologies and tools all under one roof at April 24–28, 2017, at the Westin San Diego in San Diego, CA. Explore the Mobile Dev + Test and IoT Dev + Test Expo and enjoy all of these unique opportunities: The latest solutions, technologies, and tools in mobile or IoT software development and testing. Meet one-on-one with representatives from some of today's most innovative organizations
20th Cloud Expo, taking place June 6-8, 2017, at the Javits Center in New York City, NY, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy.
SYS-CON Events announced today that Super Micro Computer, Inc., a global leader in Embedded and IoT solutions, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 7-9, 2017, at the Javits Center in New York City, NY. Supermicro (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and E...
SYS-CON Events announced today that Linux Academy, the foremost online Linux and cloud training platform and community, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Linux Academy was founded on the belief that providing high-quality, in-depth training should be available at an affordable price. Industry leaders in quality training, provided services, and student certification passes, its goal is to c...