|By Business Wire||
|December 18, 2012 09:05 AM EST||
Canon U.S.A., Inc., a leader in digital imaging solutions, recently launched sales of the new FPA-3030i5+ i-line stepper. The FPA-3030i5+ is designed to provide a long-term manufacturing solution for manufacturers of energy-efficient, environmentally conscious devices*1 including Light-Emitting Diodes (LEDs),MicroElectroMechanical Systems (MEMS)*2 and power semiconductors*3.
As awareness of clean energy and energy conservation continues to increase, demand has simultaneously increased for new environmentally conscious technologies including wind and solar power, high-efficiency vehicles and low-power facilities. As a result, manufacturers of these devices have unique process requirements that have been incorporated into the FPA-3030i5+ semiconductor stepper design that, along with optional equipment available to be purchased separately, will help facilitate these process requirements.
The FPA-3030i5+ represents a new product platform, designed specifically to provide a flexible solution for a variety of users, including power semiconductor, LED and MEMS manufacturers.
Canon FPA-3030 platform provides performance and productivity improvements
The FPA-3030 platform represents an upgrade to earlier Canon “FPA-3000 platform” steppers. The FPA-3030i5+ features an overhauled software structure and electrical control system that allow application of optional advanced hardware (e.g., projection lens, wafer stage, and alignment system) that is not compatible with traditional FPA-3000 platform steppers.
The FPA-3030i5+ is capable of providing imaging resolution below 0.35μm*4, while maintaining overlay accuracy of less than or equal to 40nm*5 and throughput equal to or in excess of 104 wafers per hour*6. Canon developed the FPA-3030i5+ system to meet and exceed the imaging, overlay and productivity requirements of those environmentally conscious devices and MEMS manufacturers.
Canon FPA-3030 platform supports optional equipment designed for special substrate materials required for energy reducing devices and MEMS manufactures
The FPA-3030 platform allows the use of optional equipment designed for the processing of silicon (Si), sapphire (Al2O3), silicon carbide (SiC) and a wide variety of wafer materials used in environmentally conscious device manufacturing. Optional equipment for the FPA-3030i5+ includes warped-wafer handling systems to allow processing of distorted substrates, and advanced image processing systems for clear substrates.
With the purchase of the optional Multi-Size Wafer Kit, the FPA-3030i5+ stepper can also be configured to process multiple wafer sizes, and can be equipped with other optional equipment to help improve productivity and efficiency.
Canon FPA-3030i5+ stepper feature summary
1. FPA-3030i5+ imaging system provides 0.35μm resolution with a flexible optical system and lens
- FPA-3030i5+ lens and optical system specifications equal FPA-3000 platform specifications.
- Variable Lens NA (0.45-0.63) and illumination Sigma (σ, 0.3-0.7 @ NA0.63) allows control of resolution and depth of focus.
- The FPA-3030i5+ optical system supports Off-Axis Illumination and provides imaging resolution requested by manufacturers of energy efficient devices.
2. FPA-3030i5+ platform enhancements help provide alignment accuracy and reliability
- FPA-3030i5+ is equipped with field-proven stage drive and damper control systems to provide high stability and reliability.
- Wafer stage position is controlled by Laser Interferometer System and wafer alignment scope.
- FPA-3030i5+ is capable of overlay accuracy less than or equal to 40nm to support production of highly efficient devices.
3. FPA-3030i5+ platform supports optional equipment designed to process special environmentally conscious device substrates
- With the purchase of the optional special-substrate handling system, the FPA-3030i5+ supports special substrates widely used in manufacturing of environmentally conscious devices, including silicon (Si), sapphire (Al2O3) and gallium arsenide (GaAs).
- With the purchase of the optional warped wafer handling system the FPA-3030i5+ supports processing of wafers warped and distorted by earlier process steps.
- FPA-3030i5+ supports overlay correction for random wafer distortion effects.
- With the purchase of the optional Multi-Size Wafer Kits, the FPA-3030i5+ can process multiple wafer sizes (75mm & 100mm; 100mm & 150mm; 150mm & 200mm) without additional configuration change.
4. FPA-3030i5+ platform electrical control system and software are modernized to help support future semiconductor manufacturing
- FPA-3030i5+ adopts systems developed for the “FPA-5500 platform” steppers. FPA-5500 steppers are widely accepted as a leading exposure system for high-volume memory devices*7, image sensors*8 and advanced packaging applications.
- The new FPA-3030i5+ e-Console software structure allows compatibility and migration of process and exposure conditions from earlier FPA-3000 platform systems
Market trends for semiconductor lithography equipment
Demand for low-power consumption systems and vehicles, social infrastructure improvements such as wind, solar and smart grid products have increased as society becomes more aware of the importance of conserving energy and reducing environmental impacts. Semiconductor lithography equipment supporting environmentally conscious devices must provide process flexibility to meet the wide range of requirements from manufacturers of environmentally conscious devices.
About Canon U.S.A., Inc.
Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions. With approximately $45.6 billion in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents registered in 2011† and is one of Fortune Magazine's World’s Most Admired Companies in 2012. In 2012, Canon U.S.A. has received the PCMag.com Readers’ Choice Award for Service and Reliability in the digital camera and printer categories for the ninth consecutive year, and for camcorders for the past two years. Canon U.S.A. is committed to the highest level of customer satisfaction and loyalty, providing 100 percent U.S.-based consumer service and support for all of the products it distributes. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To keep apprised of the latest news from Canon U.S.A., sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss.
†Based on weekly patent counts issued by United States Patent and Trademark Office.
All referenced product names, and other marks, are trademarks of their respective owners.
Availability and specifications of all products are subject to change without notice.
*1 General term for electronic components designed to reduce environmental impact
*2 Electric machinery microelements used in smartphones, etc. (ex. accelerometer, gyroscope)
*3 Semiconductors to control motors, lighting, and power supply and conversion.
*4 1 μm (micrometer) = (1 meter) / ( 1 million)
*5 1 nm (nanometer) = (1 meter) / ( 1 billion)
*6 200mm wafers, 60 shots per wafer
*7 Memory devices used in digital information equipment such as smartphones and personal computers
*8 Image Sensors used in digital cameras and mobile phone cameras
GENBAND has announced that SageNet is leveraging the Nuvia platform to deliver Unified Communications as a Service (UCaaS) to its large base of retail and enterprise customers. Nuvia’s cloud-based solution provides SageNet’s customers with a full suite of business communications and collaboration tools. Two large national SageNet retail customers have recently signed up to deploy the Nuvia platform and the company will continue to sell the service to new and existing customers. Nuvia’s capabilities include HD voice, video, multimedia messaging, mobility, conferencing, Web collaboration, deskt...
Mar. 27, 2015 01:00 AM EDT Reads: 1,307
The Open Compute Project is a collective effort by Facebook and a number of players in the datacenter industry to bring lessons learned from the social media giant's giant IT deployment to the rest of the world. Datacenters account for 3% of global electricity consumption – about the same as all of Switzerland or the Czech Republic -- according to people I met at the recent Open Compute Summit in San Jose. With increasing mobility at the edge of the cloud and vast new dataflows being predicted with the growth of the Internet of Things (and The Coming Age of Many Zettabytes) in the near...
Mar. 27, 2015 01:00 AM EDT Reads: 1,696
Wearable technology was dominant at this year’s International Consumer Electronics Show (CES) , and MWC was no exception to this trend. New versions of favorites, such as the Samsung Gear (three new products were released: the Gear 2, the Gear 2 Neo and the Gear Fit), shared the limelight with new wearables like Pebble Time Steel (the new premium version of the company’s previously released smartwatch) and the LG Watch Urbane. The most dramatic difference at MWC was an emphasis on presenting wearables as fashion accessories and moving away from the original clunky technology associated with t...
Mar. 26, 2015 11:45 PM EDT Reads: 971
The WebRTC Summit 2014 New York, to be held June 9-11, 2015, at the Javits Center in New York, NY, announces that its Call for Papers is open. Topics include all aspects of improving IT delivery by eliminating waste through automated business models leveraging cloud technologies. WebRTC Summit is co-located with 16th International Cloud Expo, @ThingsExpo, Big Data Expo, and DevOps Summit.
Mar. 26, 2015 10:45 PM EDT Reads: 1,202
SYS-CON Events announced today that Cisco, the worldwide leader in IT that transforms how people connect, communicate and collaborate, has been named “Gold Sponsor” of SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Cisco makes amazing things happen by connecting the unconnected. Cisco has shaped the future of the Internet by becoming the worldwide leader in transforming how people connect, communicate and collaborate. Cisco and our partners are building the platform for the Internet of Everything by connecting the...
Mar. 26, 2015 07:00 PM EDT Reads: 5,014
15th Cloud Expo, which took place Nov. 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, CA, expanded the conference content of @ThingsExpo, Big Data Expo, and DevOps Summit to include two developer events. IBM held a Bluemix Developer Playground on November 5 and ElasticBox held a Hackathon on November 6. Both events took place on the expo floor. The Bluemix Developer Playground, for developers of all levels, highlighted the ease of use of Bluemix, its services and functionality and provide short-term introductory projects that developers can complete between sessions.
Mar. 26, 2015 06:30 PM EDT Reads: 4,594
Temasys has announced senior management additions to its team. Joining are David Holloway as Vice President of Commercial and Nadine Yap as Vice President of Product. Over the past 12 months Temasys has doubled in size as it adds new customers and expands the development of its Skylink platform. Skylink leads the charge to move WebRTC, traditionally seen as a desktop, browser based technology, to become a ubiquitous web communications technology on web and mobile, as well as Internet of Things compatible devices.
Mar. 26, 2015 06:00 PM EDT Reads: 1,642
SYS-CON Events announced today that robomq.io will exhibit at SYS-CON's @ThingsExpo, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. robomq.io is an interoperable and composable platform that connects any device to any application. It helps systems integrators and the solution providers build new and innovative products and service for industries requiring monitoring or intelligence from devices and sensors.
Mar. 26, 2015 06:00 PM EDT Reads: 1,226
The list of ‘new paradigm’ technologies that now surrounds us appears to be at an all time high. From cloud computing and Big Data analytics to Bring Your Own Device (BYOD) and the Internet of Things (IoT), today we have to deal with what the industry likes to call ‘paradigm shifts’ at every level of IT. This is disruption; of course, we understand that – change is almost always disruptive.
Mar. 26, 2015 05:15 PM EDT Reads: 826
WebRTC is an up-and-coming standard that enables real-time voice and video to be directly embedded into browsers making the browser a primary user interface for communications and collaboration. WebRTC runs in a number of browsers today and is currently supported in over a billion installed browsers globally, across a range of platform OS and devices. Today, organizations that choose to deploy WebRTC applications and use a host machine that supports audio through USB or Bluetooth can use Plantronics products to connect and transit or receive the audio associated with the WebRTC session.
Mar. 26, 2015 05:00 PM EDT Reads: 1,464
Docker is an excellent platform for organizations interested in running microservices. It offers portability and consistency between development and production environments, quick provisioning times, and a simple way to isolate services. In his session at DevOps Summit at 16th Cloud Expo, Shannon Williams, co-founder of Rancher Labs, will walk through these and other benefits of using Docker to run microservices, and provide an overview of RancherOS, a minimalist distribution of Linux designed expressly to run Docker. He will also discuss Rancher, an orchestration and service discovery platf...
Mar. 26, 2015 04:15 PM EDT Reads: 2,287
SYS-CON Media announced today that @WebRTCSummit Blog, the largest WebRTC resource in the world, has been launched. @WebRTCSummit Blog offers top articles, news stories, and blog posts from the world's well-known experts and guarantees better exposure for its authors than any other publication. @WebRTCSummit Blog can be bookmarked ▸ Here @WebRTCSummit conference site can be bookmarked ▸ Here
Mar. 26, 2015 04:00 PM EDT Reads: 1,551
SYS-CON Events announced today that Alert Logic, the leading provider of Security-as-a-Service solutions for the cloud, has been named “Bronze Sponsor” of SYS-CON's 16th International Cloud Expo® and DevOps Summit 2015 New York, which will take place June 9-11, 2015, at the Javits Center in New York City, NY, and the 17th International Cloud Expo® and DevOps Summit 2015 Silicon Valley, which will take place November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA.
Mar. 26, 2015 04:00 PM EDT Reads: 1,457
Sonus Networks introduced the Sonus WebRTC Services Solution, a virtualized Web Real-Time Communications (WebRTC) offer, purpose-built for the Cloud. The WebRTC Services Solution provides signaling from WebRTC-to-WebRTC applications and interworking from WebRTC-to-Session Initiation Protocol (SIP), delivering advanced real-time communications capabilities on mobile applications and on websites, which are accessible via a browser.
Mar. 26, 2015 04:00 PM EDT Reads: 1,612
SYS-CON Events announced today that Aria Systems, the leading innovator in recurring revenue, has been named “Bronze Sponsor” of SYS-CON's @ThingsExpo, which will take place on June 9–11, 2015, at the Javits Center in New York, NY. Proven by the world’s most demanding enterprises, including AAA NCNU, Constant Contact, Falck, Hootsuite, Pitney Bowes, Telekom Denmark, and VMware, Aria helps enterprises grow their recurring revenue businesses. With Aria’s end-to-end active monetization platform, global brands can get to market faster with a wider variety of products and services, while maximizin...
Mar. 26, 2015 04:00 PM EDT Reads: 1,451
SYS-CON Events announced today that Vitria Technology, Inc. will exhibit at SYS-CON’s @ThingsExpo, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Vitria will showcase the company’s new IoT Analytics Platform through live demonstrations at booth #330. Vitria’s IoT Analytics Platform, fully integrated and powered by an operational intelligence engine, enables customers to rapidly build and operationalize advanced analytics to deliver timely business outcomes for use cases across the industrial, enterprise, and consumer segments.
Mar. 26, 2015 03:30 PM EDT Reads: 2,040
SYS-CON Events announced today that Solgenia will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY, and the 17th International Cloud Expo®, which will take place on November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. Solgenia is the global market leader in Cloud Collaboration and Cloud Infrastructure software solutions. Designed to “Bridge the Gap” between Personal and Professional Social, Mobile and Cloud user experiences, our solutions help large and medium-sized organizations dr...
Mar. 26, 2015 03:00 PM EDT Reads: 2,521
SYS-CON Events announced today that Liaison Technologies, a leading provider of data management and integration cloud services and solutions, has been named "Silver Sponsor" of SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York, NY. Liaison Technologies is a recognized market leader in providing cloud-enabled data integration and data management solutions to break down complex information barriers, enabling enterprises to make smarter decisions, faster.
Mar. 26, 2015 03:00 PM EDT Reads: 3,305
Connected devices and the Internet of Things are getting significant momentum in 2014. In his session at Internet of @ThingsExpo, Jim Hunter, Chief Scientist & Technology Evangelist at Greenwave Systems, examined three key elements that together will drive mass adoption of the IoT before the end of 2015. The first element is the recent advent of robust open source protocols (like AllJoyn and WebRTC) that facilitate M2M communication. The second is broad availability of flexible, cost-effective storage designed to handle the massive surge in back-end data in a world where timely analytics is e...
Mar. 26, 2015 02:45 PM EDT Reads: 4,629
SYS-CON Events announced today that Akana, formerly SOA Software, has been named “Bronze Sponsor” of SYS-CON's 16th International Cloud Expo® New York, which will take place June 9-11, 2015, at the Javits Center in New York City, NY. Akana’s comprehensive suite of API Management, API Security, Integrated SOA Governance, and Cloud Integration solutions helps businesses accelerate digital transformation by securely extending their reach across multiple channels – mobile, cloud and Internet of Things. Akana enables enterprises to share data as APIs, connect and integrate applications, drive part...
Mar. 26, 2015 02:15 PM EDT Reads: 1,306